The WS 13 vertical lift stage. Combining high load capacity with high-speed dynamics for next-generation wafer inspection 

Overview

The WS13 vertical lift stage by LAB Motion Systems redefines vertical motion control by offering an unparalleled combination of high payload capacity, precision and dynamics—all within a compact, low-profile design. It addresses the limitations of traditional vertical stages by delivering 30 kg load capacity alongside fast settling times, high acceleration, and nanometer-level resolution, making it ideal for demanding semiconductor and photonics applications. 

Challenge

In advanced semiconductor processes and inspection systems, engineers often face a trade-off:
• Ball screw-driven systems support heavy loads but lack speed and precision.
• Direct-drive systems offer speed but can’t handle large payloads.
Until now, no single solution could simultaneously meet both requirements—particularly in high-frequency autofocus or wafer inspection workflows, where precision and dynamics are equally critical.

WS13 Solution

The WS13 stage is a breakthrough in vertical actuation. By integrating a contactless linear motor, frictionless mass compensation system, and high-resolution encoder, it enables:
• Nanometer precision with MIM of just 10 nm
• Exceptional load capacity: Up to 30 kg
• Dynamic performance: Fast settling, high acceleration, and speed (≥30 mm/s)
• Low profile design with 13 mm stroke, ideal for confined setups
• Bi-directional repeatability of ±0.3 µm
• Excellent straightness, pitch, yaw, and roll performance
Its unique mass compensation technology allows to lift other motion stages or heavy chucks without sacrificing responsiveness, solving a key bottleneck in high-throughput manufacturing environments.

Seamless system integration 

The WS13 is designed to integrate effortlessly with LAB’s advanced motion systems:
• Fully compatible with the RZ2000 and RT-S series air bearing rotary stages
• Enables complex multi-axis architectures for high-precision wafer handling

Use cases 

Unpatterned wafer inspection: Acts as a long-stroke Z-stage under dynamic RZ systems
• High-frequency autofocus: Critical for direct laser writing and metrology
• Semiconductor test & packaging: Lifts wafers with speed and safety
• Research labs: Delivers high accuracy in compact experimental setups

Key Specifications 

Parameters              Value

Load capacity                            30 kg

Stroke                                          13 – 14 mm / Up to 25 mm (customized)

Speed                                           30 mm/s

Acceleration                                1500 mm/s2

Bi-directional repeatability        ±0.3 µm / ±0.15 µm

Minimum Incremental Motion  10 nm

Straightness                                 ±1.6 µm

Pitch / Yaw / Roll                         ±6 / ±5 / ±5 arcsec

Material                                         Aluminium

Encoder                                         Absolute or Incremental

Dynamics                                      130 Hz bandwidth with 7 kg payload

Stage mass                                   12.5 kg

Industries Served  

• Semiconductor manufacturing

Conclusion

The WS13 vertical lift stage sets a new benchmark for high-load, high-dynamic vertical actuation. With its revolutionary mass compensation design and integration-ready platform, it empowers engineers to push the limits of inspection, metrology, and manufacturing precision—without compromise.